Terms and Conditions * I agree to the Terms and Conditions
J & L Capital Resources agrees to diligently pursue potential financing sources on behalf of applicant. However, J & L Capital Resources does not warrant or represent that it will be able to secure financing acceptable to applicant. Applicant agrees to indemnify and hold J & L Capital Resources harmless with respect to any claims or disputes with lending source and/or supplier of equipment. Applicant warrants that all credit and financial information is true and correct and authorizes bank and credit references to release information to J & L Capital Resources, their assignees, or any lending source to whom this application is submitted. It is agreed that information provided is without liability to the provider. Applicant agrees to furnish financial statements and tax returns upon request. Applicant authorizes J & L Capital Resources, their assignees, or any lending source to whom this application is submitted to obtain a credit report or to carry out and complete any credit investigations of Applicant and its principals which they deem reasonably necessary to process this application. Applicant may be required to deposit funds with a lending source and/or supplier of equipment. J & L Capital Resources shall not be responsible to Applicant with respect to this deposit in the event it is not returned to Applicant for any reason. Attorney’s Fees - In the event that any party institutes any action or suit to enforce this agreement or to secure relief from any default hereunder or breach hereof, the breaching party or parties shall reimburse the non-breaching party or parties for all costs, including reasonable attorney’s fees, incurred in connection therewith and in enforcing any judgment rendered therein. By signing or entering your name below, you are authorizing J & L Capital Resources to process this application and that the copy of the application printed will be considered as the original until such time as the Applicant is asked to sign and date a new application.